Rayson Technology’s BTM-N340X employs nRF5340 SoC for LE Audio plus advanced metering and home automation applications
Wireless communications company Rayson Technology has released a multiprotocol module based on Nordic Semiconductor’s nRF5340 System-on-Chip (SoC). The SoC is designed for advanced Bluetooth® LE Audio applications, as well as metering, wearable, smart home, industrial, and medical use cases. Measuring just 16.5 by 13.0 by 2.5 mm, the ‘BTM-N340X’ module supports LE Audio and its Low Complexity Communication Codec (LC3), which together enable higher quality, lower power wireless audio streaming compared with existing Classic Bluetooth audio solutions.
The module employs the nRF5340 SoC’s dual Arm Cortex-M33 processors – providing a high performance application processor capable of DSP and Floating Point (FP) alongside a fully programmable, ultra low power network processor. The application core manages the LC3 codec, while the Bluetooth LE protocol is supervised by the network processor.
Designed for wireless audio
“The BTM-N340X module has been designed for a wide range of applications, aiming in particular to provide enhanced audio experiences via Bluetooth LE Audio,” says Bob Wu, CTO at Rayson Technology. “It enables one device to stream audio to multiple pairs of wireless headphones, and can facilitate audio broadcasts through public address systems, such as in airports and museums. This module is also compatible with smart speakers and home audio systems.”
The module’s ultra-low power consumption is made possible due to the nRF5340’s power-optimized multiprotocol radio, which offers a TX current of 3.4 mA (0 dBm TX power, 3 V, DC/DC) and RX current of 2.7 mA (3 V, DC/DC). The sleep current is as low as 0.9 µA. Additionally, because the cores can operate independently, developers have the flexibility to optimize performance for power consumption, throughput, and low latency response.
Available with two antenna options
Two flexible antenna options are available for the module—a pre-certified U.F.L Connector and a PCB pin out—depending on the product application. The module is designed to operate within a temperature range of -40 to +85°C.
“The dual processors made the nRF5340 SoC an excellent choice for this module’s LE Audio applications,” says Wu. “The large memory capacity, radio sensitivity, and low power consumption were also major drawcards. In addition to the excellent technical capabilities of the chip, the high level of support from Nordic was a key factor when making our selection.”
Related Articles
STMicroelectronics teams with Microsoft to boost development of Smart, Connected Devices
Integration lets STM32 developers access Microsoft Azure RTOS (Real-Time Operating System) for embedded projects STMicroelectronics has signed an agreement with Microsoft that the two companies claim will simplify and accelerate the development of smart-appliance...
Qualcomm SoC series to bring true wireless earbud features
New SoCs designed to meet demand for advanced wireless audio use cases and end-to-end support for Bluetooth LE Audio Qualcomm Technologies has unveiled the Qualcomm QCC305x SoCs, which the company says are designed specifically to help its customers differentiate...
Multistack LPWAN kit eases smart city design applications
Smart parking, environment monitoring, smart agriculture, building automation, asset tracking, industrial control, smart metering and emergency service response are some of the use cases Murata, in cooperation with technology partner Sentinum, has introduced a...
Stay Up to Date With The Latest News & Updates
Our Sponsors
Incisor.TV partners with leading organisations in the technology sector.
Follow Us
And stay up to date with our news! We are active across the key social media platforms – please do follow us!



0 Comments